EIPC June Summer Conference

The Spirit team is looking forward to attending EIPC’s Summer Conference next month.

EIPC’s Summer Conference Luxembourg is a diverse and informative conference. The two-day programme is set to be particularly strong this year and we can’t wait to attend the presentations and deliver one of our own. The programme will offer a look at the latest technologies and innovations in the pcb industry with pioneers from the industry delivering their own presentations.

On day one our MD, Steve Driver, will introduce Spirit’s nanotherm metal-backed PCB technology. His presentation will detail Spirit’s leading edge thermal management products and present how our cost-effective solution for thermally-challenged designs offer particular benefits for the LED lighting arena.

Further talks to be held on day one include a keynote presentation from Phil Plonski, of Prismark Partners LLC, titled, “New Design Trends and Manufacturing Technologies - The Challenges and Opportunities.”

Emerging qualification requirements for FR4 will be explained by Gordon Biezeveld from Underwriters Laboratories. MacDermid will present “Copper Plating Process for Filling Micro vias and Through via Holes with Minimum Surface Deposition”. AOI will be the subject of a paper from Orbotech before the afternoon of gives way to a visit to Circuit Foil Luxembourg.

On Day two, non-destructive testing of solderable finishes (ASPIS) will be illustrated by Erik Veninga, of TNO. Ultrasound as an enabling technology for sustainable electronic manufacturing (Susonence) will be described by Dr. Andrew Cobley, from The University of Coventry in the UK.

Also from the UK, Professor Sudipta Roy of Royenface will introduce maskless lithography. From Hungary, Magdolna Lakatos, Hitelap will speak on pulse-plated nanostructured iron layers for microelectronic applications. The famous faces of Polar Instruments Ltd. in the UK will be seen, the first being Neil Chamberlain expounding considerations for the routing of ultra-high -seed differential pairs on PCBs. Accurate insertion loss and Impedance modelling of PCB traces will be covered by Martyn Gaudion via a co-authored paper with Intel Corporation.

A look toward new technology solutions and future challenges will be carried out in papers by Nikola Kontic, Zuken UK Limited; Martin Cotton, Sanmina, DE. Reductive activation on Laser Direct Structuring will be announced in a joint presentation from Dr. Ulrich Prinz, of Enthone GmbH, and Arne Schnoor, LPKF Laser & Electronics AG, DE. Dr. Chris Hunt from the National Physical Laboratories in the UK will explain how to use printed electronics to improve electronics sustainability with a novel reusable, unzippable sustainable electronics (ReUSE) interconnect system. The intriguing PCB technology used to manufacture stretchable circuits will be explained by Jan Vanfleteren from the University of Ghent in Belgium, and bringing the conference to a close, Raymond Gales of Circuit Foil in Luxembourg will cover the subject of Differentiation through technology for Chip Scale Packaging with ultra‐thin peelable copper foils for MSAP and coreless build up.

For more information, e-mail eipc@eipc.org, call +31‐43‐3440872, or visit www.eipc.org. Early Bird deadline is May 17, 2013.